Starnberg (Germany) 29 April 2009 - The MOST Forum 2010 will take place on March 23, 2010, concurrent with the MOST Cooperation's All Members Meeting. This one-day industry event on automotive infotainment technology will take place in Stuttgart, Germany, presenting the latest and future technologies and applications based on MOST. " We received very positive feedback for the MOST Cooperation's support of the MOST Forum and have decided to combine the event with the 2010 All Members Meeting", states Harald Schoepp, member of the MOST Cooperation Steering Committee. "MOST Cooperation members will enjoy exclusive benefits when attending the conference and exhibiting their solutions to the MOST community. We encourage all infotainment experts to submit a conference paper on their latest MOST designs and application results."Suggested topics include but are not limited to MOST physical layer, MOST networking and system architecture, MOST software and protocols, MOST compliance and quality, MOST series projects experience, MOST and other standards, as well as research and miscellaneous topics such as consumer products in the car. The Call for Speakers is now open and anyone interested is invited to submit a proposal for a paper by June 19, 2009. The goal is to cover a broad field of topics with a wide range of information. The MOST Forum provides an ideal venue to share ideas and experiences, and to discuss the latest news on this de-facto automotive infotainment standard. The international conference and exhibition will bring together top professionals from the automotive electronics industry and academia to exchange information and results of their recent work on the leading infotainment technology. The broad international audience will include researchers, designers, engineers, system developers, as well as purchasers and journalists, up to managers of the industries involved. The industry partners SAE International (http://www.sae.org) and ZVEI (Electrical and Electronic Manufacturers' Association, http://www.zvei.org) as well as the media partners Auto Electronics (http://www.autoelectronics.com), Elektronik automotive (http://www.elektroniknet.de) and ElektronikPraxis (http://www.elektronikpraxis.de) are contributing their expertise and technology know-how to set up a premier conference program.
Binghamton, NY - Electronic Links International, Inc. today announces that the United States Patent office has granted to the company founder two patents in the field of Plastic Optical Fiber. The first patent titled: EMI SHIELD FOR OPTICAL CONNECTOR, identified with the number US 7,367,719 has 22 claims. It covers features such as shielding, alignment, heat sink for Rosa and Tosa, etc. When mated with a connector cable assembly, the connector system has one of the best data rates in the industry.
One of the main focal points of
Cork, Ireland - Firecomms, a provider of high-speed Plastic Optical Fiber components, today announces the compatibility of its OptoLock® Fast Ethernet optical transceiver with the Ethernet PHY integrated in Broadcom’s BCM7405 IP set-top box (STB) system-on-a-chip (SoC) solution. Firecomms will demonstrate its OptoLock technology at this week’s IPTV World Forum on Firecomms booth #95 in London’s Olympia Grand Hall.
This year's OFC/NFOEC Conference and Exhibition held March 24-27 at the San Diego Convention Center had a total attendance of 9,300 down from about 11,000 in 2008. This is to be expected with the economy the way that it is. Despite the lower attendance, the POF Applications Center had a brisk flow of interested attendees.




